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Senju Metal Materials Co.,Ltd.

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Tel:0769-81665388-868

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Details  
Sn-Pb solder its excellent performance and low cost has become the electronic assembly of the welding material, but the lead and its compounds are hazardous substances, in the twentieth century, ninety early, the EU has a strong environmental awareness through ROHS bill limits the use of lead, and clearly defined from the 2006 of 7 1 date of implementation. Taiwan Tin Tin (Hong Kong) putting in a lot of energy, since 2003 in volume production since lead-free solder products, has been in line with international environmental requirements.
Antioxidant tin lead-free:
Features: Suitable for hand-dip soldering, wave soldering circuit boards bright spot, producing less residue, the working temperature is higher than the melting point of 40 ~ 60 ℃ job best.
Grade
Alloy composition
Melting point (℃)
Share
proposed use
Solidus
Liquidus
T101A
Sn99.95
232
232
7.28
peak furnace to add, drop Cu
T703A
Sn-Cu0.3
227
230
7.31
T705A
Sn-Cu0.5-Ni
226
226
7.32
board hand dip soldering, wave soldering
T707A
Sn-Cu0.7
227
227
7.32
T303A
Sn-Ag0.3-Cu0.7
217
228
7.33
T330A
Sn-Ag3.0-Cu0.5
217
218
7.40

Lead (dip line, HAL) for the tin:
Features: Suitable Components feet, bare copper and immersion tin PCB HASL process, the working temperature of 300 ~ 380 ℃ in the temperature of operation
Grade
Alloy composition
Melting point (℃)
Weight ()
Proposed use
Solidus
Liquidus
T101A
Sn99.95
232
232
7.28
Add tin, lower copper content
T705A
Sn-Cu0.5-Ni
226
226
7.32
HAL open cylinder with a
T705N
Sn-Ni0.02
230
232
7.28
HAL added by
T707
Sn-Cu0.7
227
227
7.32
No items
feet, bare copper wire impregnated

High temperature lead-free tin:
Features: Suitable for enameled wire, transformers, a paint stripping, fast on the tin, the working temperature is 400 ~ 480 ℃ work best, the tin surface smooth and can not afford to film, the first product for the transformer.
Grade
Alloy composition
Melting point (℃)
Weight ()
Proposed use
Solidus
Liquidus
T707B
Sn-Cu0.7
227
227
7.32
Enameled wire, transformers dip tin
T330B
Sn-Ag3.0-Cu0.5
217
218
7.40

Low temperature lead-free tin:
Features: Suitable for electronic temperature control components, fire alarm, high buildings, the amount of libraries, high-pressure food utensils, special corners, glass ceramic welding, die molding manufacturing process.
Alloy composition
Melting point (℃)
Proposed use
Sn-Cu-Bi
200
220 ℃ about welding
Sn-Bi
138
180 ℃ about welding

Properties of lead-free solder Help
Category
Melting point (℃)
Tensile strength ()
Ductility (% )
Sn-Ag-Cu
217
5.3
27
Sn-Ag
221
4.7
33
Sn-Cu
227
3.3
48
Sn-Bi
138
7.6
33



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