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Solder News
Leaded wave soldering copper (Cu) impurities in the management of
Publisher:  Release time:2011-5-22 
In the practical application of lead solder in the solder on copper (Cu) content of electronic technology and solder materials engineering profession have reached a consensus: tin-copper (Cu) content should be controlled about 0.15%, when the tin solder copper furnace (Cu) content of more than 0.15%, the incorporation of new material must be diluted copper content, while copper (Cu) content reached 0.3%, then the whole tin furnace solder to be replaced and the clear result of the furnace, re-join the new material. 400KG tin stove for a run, if the dilution process to take, more than 100KG need to add new material, or fail to reduce copper (Cu) results.


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