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Solder News
Lead-free wave soldering (Sn-Ag-Cu) management
Publisher:  Release time:2011-5-22 
recommended in Japan is SnAg3.0Cu0.5 alloy (referred to as SAC305 ), while in Europe recommended is SnAg3.8Cu0.7 alloy. Sn-Ag-Cu Lead-free solder has the advantage of good solderability, wetting strength, wetting speed and high temperature stability are better. Solder joints of high mechanical strength, melting point 21 7 ℃ -22 1 ℃. The The biggest drawback is silver with precious metal (Ag). Therefore, the relatively high cost of solder, because of the need to select based on actual production.

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